Daquan Ma : rechercher sur Z-Library

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1

Simplified low-temperature wafer-level hybrid bonding using pillar bump and photosensitive adhesive for three-dimensional integrated circuit integration

Yao, Mingjun, Fan, Jun, Zhao, Ning, Xiao, Zhiyi, Yu, Daquan, Ma, Haitao

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2017

Langue:

english

Fichier:

PDF, 1.18 MB

english, 2017

2

Optimization and Characterization of Low-Temperature Wafer-Level Hybrid Bonding Using Photopatternable Dry Film Adhesive and Symmetric Micro Cu Pillar Solder Bumps

Yao, Mingjun, Zhao, Ning, Wang, Teng, Yu, Daquan, Xiao, Zhiyi, Ma, Haitao

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2018

Langue:

english

Fichier:

PDF, 4.11 MB

english, 2018

3

[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs

Yao, Mingjun, Zhao, Ning, Yu, Daquan, Xiao, Zhiyi, Ma, Haitao

Année:

2018

Langue:

english

Fichier:

PDF, 8.27 MB

english, 2018

4

Tobacco smoking, alcohol consumption, and risk of oral cancer: a case-control study in Beijing, People's Republic of China

Tongzhang Zheng, Peter Boyle, Huanfang Hu, Jun Duan, Peijae Jiang, Daquan Ma, Liangpeng Shui, Shiru Niu, Brian MacMahon

Journal:

Cancer Causes & Control

Année:

1990

Langue:

english

Fichier:

PDF, 595 KB

english, 1990

5

The development of effective model for thermal conduction analysis for 2.5D packaging using TSV interposer

Ma, He, Yu, Daquan, Wang, Jun

Journal:

Microelectronics Reliability

Année:

2014

Langue:

english

Fichier:

PDF, 3.46 MB

english, 2014

6

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - IR drop analysis in mobile IC package with consideration of self-heating and leakage power

Qin, Zheng, Wang, Zhi, Ma, He, Zhang, Shuqiang, Yu, Daquan

Année:

2015

Langue:

english

Fichier:

PDF, 891 KB

english, 2015

7

Development of Reliable, High Performance WLCSP for BSI CMOS Image Sensor for Automotive Application

Zhou, Tianshen, Ma, Shuying, Yu, Daquan, Li, Ming, Hang, Tao

Journal:

Année:

2020

Fichier:

PDF, 62.95 MB

2020

8

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Development and Reliability study of 3D WLCSP for automotive CMOS image sensor using TSV technology

Ma, Shuying, Liu, Yi, Zheng, Fengxia, Li, Feng, Yu, Daquan, Xiao, Aimo, Yang, Xiaobing

Année:

2020

Fichier:

PDF, 924 KB

2020

9

Dentition, oral hygiene, and risk of oral cancer: a case-control study in Beijing, People's Republic of China

Tongzhang Zheng, Peter Boyle, Huanfang Hu, Jun Duan, Peijue Jiang, Daquan Ma, Liangpeng Shui, Shiru Niu, Crispian Scully, Brian MacMahon

Journal:

Cancer Causes & Control

Année:

1990

Langue:

english

Fichier:

PDF, 443 KB

english, 1990

10

Solitons in thermal media with periodic modulation of linear refractive index

Xuekai Ma, Zhenjun Yang, Daquan Lu, Wei Hu

Journal:

Optics Communications

Année:

2012

Langue:

english

Fichier:

PDF, 570 KB

english, 2012

11

Precambrian Geological Evolution in the Yangtze Gorges Area, China

Wang Xiaofeng, Ma Daquan, Chen Xiaohong

Journal:

Gondwana Research

Année:

1999

Langue:

english

Fichier:

PDF, 699 KB

english, 1999

12

Precambrian Evolution of the Huangling Arch, China and its Relation to the Rodinia Breakup and Assembly

Xiaofeng Wang, Ma Daquan, Chen Xiaohong, Wang Chuanshang

Journal:

Gondwana Research

Année:

2001

Langue:

english

Fichier:

PDF, 276 KB

english, 2001

13

Relation between surface solitons and bulk solitons in nonlocal nonlinear media

Yang, Zhenjun, Ma, Xuekai, Lu, Daquan, Zheng, Yizhou, Gao, Xinghui, Hu, Wei

Journal:

Année:

2011

Langue:

english

Fichier:

PDF, 2.18 MB

english, 2011

14

Identification of Sheep Ovary Genes Potentially Associated with Off-season Reproduction

Lei Chen, Ka Liu, Zongsheng Zhao, Hugh T. Blair, Peng Zhang, Daquan Li, Runlin Z. Ma

Journal:

Journal of Genetics and Genomics

Année:

2012

Langue:

english

Fichier:

PDF, 625 KB

english, 2012

15

A new nutritional assessment in patients with oral and maxillofacial malignancies

Chuanbin Guo, Huaxun Guo, Daquan Ma

Journal:

Auris Nasus Larynx

Année:

1997

Langue:

english

Fichier:

PDF, 62 KB

english, 1997

16

Factors influencing survival rate in adenoid cystic carcinoma of the salivary glands

Minxian Huang, Daquan Ma, Kaihua Sun, Guangyan Yu, Chuanbin Guo, Feng Gao

Journal:

International Journal of Oral & Maxillofacial Surgery

Année:

1997

Langue:

english

Fichier:

PDF, 433 KB

english, 1997

17

A murine model for human immune thrombocytopenic purpura and comparative analysis of multiple gene expression in bone marrow and spleen

Hong Wei, Xinchun Ding, Jiangong Ren, Ka Liu, Pingping Tan, Daquan Li, Runlin Z. Ma

Journal:

Journal of Genetics and Genomics

Année:

2008

Langue:

english

Fichier:

PDF, 441 KB

english, 2008

18

Prognostic value of K-RAS mutations in patients with non-small cell lung cancer: A systematic review with meta-analysis

Meng, Daquan, Yuan, Mingli, Li, Xiaojuan, Chen, Lijun, Yang, Jie, Zhao, Xin, Ma, Wanli, Xin, Jianbao

Journal:

Année:

2013

Langue:

english

Fichier:

PDF, 2.53 MB

english, 2013

19

Tobacco Smoking, Alcohol Consumption, and Risk of Oral Cancer: A Case-Control Study in Beijing, People's Republic of China

Tongzhang Zheng, Peter Boyle, Huanfang Hu, Jun Duan, Peijue Jiang, Daquan Ma, Liangpeng Shui, Shiru Niu and Brian MacMahon

Journal:

Cancer Causes & Control

Année:

1990

Langue:

english

Fichier:

PDF, 1.21 MB

english, 1990

20

Dentition, Oral Hygiene, and Risk of Oral Cancer: A Case-Control Study in Beijing, People's Republic of China

Tongzhang Zheng, Peter Boyle, Huanfang Hu, Jun Duan, Peijue Jiang, Daquan Ma, Liangpeng Shui, Shiru Niu, Crispian Scully and Brian MacMahon

Journal:

Cancer Causes & Control

Année:

1990

Langue:

english

Fichier:

PDF, 1009 KB

english, 1990

21

[IEEE Digest of Technical Papers. 2005 Symposium on VLSI Circuits, 2005. - Kyoto, Japan (June 16-18, 2005)] Digest of Technical Papers. 2005 Symposium on VLSI Circuits, 2005. - A phase-coherent transformer enabled 2:1 frequency divider with 7dB phase noise reduction and speed-gain/power F.O.M. of 2x10/sup 2/ (pico-joule)

Daquan Huang,, Hant, W., Wen-Kuan Yeh,, Jin-Kou Ma,, Chien, C., Chang, M.F.

Année:

2005

Langue:

english

Fichier:

PDF, 504 KB

english, 2005

22

Defect solitons in parity-time-symmetric optical lattices with nonlocal nonlinearity

Hu, Sumei, Ma, Xuekai, Lu, Daquan, Zheng, Yizhou, Hu, Wei

Journal:

Physical Review A

Année:

2012

Langue:

english

Fichier:

PDF, 899 KB

english, 2012

23

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Low thermal resistance design for a 2.5D package

Wu, Xiaomeng, Liu, Xiaoyang, Ma, He, Yu, Daquan

Année:

2013

Langue:

english

Fichier:

PDF, 342 KB

english, 2013

24

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Study of equivalent thermal modeling and simulation of 2.5D/3D stacked dies module

Dai, Fengwei, Yu, Daquan, Zhou, Jing, Ma, He, Wu, Xiaomeng, Jing, Xiangmeng, Song, Chongshen, He, Hongwen

Année:

2013

Langue:

english

Fichier:

PDF, 413 KB

english, 2013

25

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Thermal analysis and heat dissipation optimization of 3D packaging with TSV interposer

Ma, He, Yu, Daquan, Wang, Jun

Année:

2012

Langue:

english

Fichier:

PDF, 1.22 MB

english, 2012

26

-symmetric Gaussian potentials

Hu, Sumei, Ma, Xuekai, Lu, Daquan, Yang, Zhenjun, Zheng, Yizhou, Hu, Wei

Journal:

Physical Review A

Année:

2011

Langue:

english

Fichier:

PDF, 776 KB

english, 2011

27

Multiple-type solutions for multipole interface solitons in thermal nonlinear media

Ma, Xuekai, Yang, Zhenjun, Lu, Daquan, Hu, Wei

Journal:

Physical Review A

Année:

2011

Langue:

english

Fichier:

PDF, 483 KB

english, 2011

28

Interface solitons in thermal nonlinear media

Ma, Xuekai, Yang, Zhenjun, Lu, Daquan, Hu, Wei

Journal:

Physical Review A

Année:

2011

Langue:

english

Fichier:

PDF, 408 KB

english, 2011

29

Solution for (1+1)-dimensional surface solitons in thermal nonlinear media

Ma, Xuekai, Yang, Zhenjun, Lu, Daquan, Guo, Qi, Hu, Wei

Journal:

Physical Review A

Année:

2011

Langue:

english

Fichier:

PDF, 592 KB

english, 2011

30

Observation of surface dark solitons in nonlocal nonlinear media

Gao, XingHui, Wang, Jing, Zhou, Luohong, Yang, ZhenJun, Ma, Xuekai, Lu, Daquan, Guo, Qi, Hu, Wei

Journal:

Année:

2014

Langue:

english

Fichier:

PDF, 645 KB

english, 2014

31

Defect solitons supported by nonlocal PT symmetric superlattices

Hu, Sumei, Lu, Daquan, Ma, Xuekai, Guo, Qi, Hu, Wei

Journal:

EPL (Europhysics Letters)

Année:

2012

Langue:

english

Fichier:

PDF, 828 KB

english, 2012

32

Stable quadratic solitons consisting of fundamental waves and oscillatory second harmonics subject to boundary confinement

Wang, Jing, Ma, Zhenlei, Li, Yiheng, Lu, Daquan, Guo, Qi, Hu, Wei

Journal:

Physical Review A

Année:

2015

Langue:

english

Fichier:

PDF, 4.04 MB

english, 2015

33

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - The process development and reliability study of low cost Area Array QFN packaging technology

Wang, Hu, Li, Taotao, Ma, Xiaobo, Wang, Xiaolong, Chen, Shiguang, Xie, Jianyou, Yu, Daquan

Année:

2014

Langue:

english

Fichier:

PDF, 449 KB

english, 2014

34

Experimental studies on traumatic facial nerve injury

Yu, Guangyan, Ma, Daquan, Tan, Jing, Yang, Zhaohui, Zhang, Xiaoming

Journal:

Journal of Laryngology & Otology

Année:

1998

Langue:

english

Fichier:

PDF, 826 KB

english, 1998

35

[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - The process development and reliability study of low cost Area Array QFN packaging technology

Wang, Hu, Li, Taotao, Ma, Xiaobo, Wang, Xiaolong, Chen, Shiguang, Xie, Jianyou, Yu, Daquan

Année:

2014

Langue:

english

Fichier:

PDF, 449 KB

english, 2014

36

Optimal design analysis for thermal performance of high power 2.5D package

Liu, Xiaoyang, Ma, He, Yu, Daquan, Chen, Wenlu, Wu, Xiaolong

Journal:

Journal of Semiconductors

Année:

2016

Langue:

english

Fichier:

PDF, 803 KB

english, 2016

37

Protective effect of hydrogen‑rich medium against high glucose‑induced apoptosis of Schwann cells inï¿½vitro

Yu, Yang, Ma, Xiaoye, Yang, Tao, Li, Bo, Xie, Keliang, Liu, Daquan, Wang, Guolin, Yu, Yonghao

Journal:

Molecular Medicine Reports

Année:

2015

Langue:

english

Fichier:

PDF, 717 KB

english, 2015

38

[Society of Petroleum Engineers Abu Dhabi International Petroleum Exhibition & Conference - Abu Dhabi, UAE (2016-11-07)] Abu Dhabi International Petroleum Exhibition & Conference - Harmless Treatment Technology of Oily Cuttings

Li, Guanghuan, Ma, Hong, Long, Tao, Huang, Daquan, Tian, Zengyan, Zhang, Aishun, Wang, Weizhong, Hou, Shili, Gong, Chunwu

Langue:

english

Fichier:

PDF, 769 KB

english

39

Minimum Secrecy Throughput Maximization in Wireless Powered Secure Communications

Guo, Chongtao, Liao, Bin, Feng, Daquan, He, Chunlong, Ma, Xiao

Journal:

IEEE Transactions on Vehicular Technology

Année:

2017

Langue:

english

Fichier:

PDF, 2.38 MB

english, 2017

40

[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - 3D wafer level compression molding process development for image sensor package

Ma, Shuying, Li, Mengqiang, Xiao, Zhiyi, Huang, Xiaohua, Yu, Daquan

Année:

2017

Langue:

english

Fichier:

PDF, 1.98 MB

english, 2017

41

[IEEE 2018 China Semiconductor Technology International Conference (CSTIC) - Shanghai (2018.3.11-2018.3.12)] 2018 China Semiconductor Technology International Conference (CSTIC) - Process development of five- and six-side molded WLCSP

Ma, Shuying, Wang, Teng, Xiao, Zhiyi, Yu, Daquan

Année:

2018

Langue:

english

Fichier:

PDF, 477 KB

english, 2018

42

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Reliability of Ultra-Thin Embedded Silicon Fan-Out (eSiFO) Package Directly Assembled on PCB for Mobile Applications

Chen, Cheng, Wang, Teng, Yu, Daquan, Ma, Shuying, Zhu, Kai, Xiao, Zhiyi, Wan, Lixi

Année:

2018

Fichier:

PDF, 546 KB

2018

43

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Embedded Silicon Fan-Out (eSiFO): A Promising Wafer Level Packaging Technology for Multi-chip and 3D System Integration

Ma, Shuying, Wang, Jiao, Zheng, Fengxia, Xiao, Zhiyi, Wang, Teng, Yu, Daquan

Année:

2018

Fichier:

PDF, 624 KB

2018

44

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Reliability of Ultra-Thin Embedded Silicon Fan-Out (eSiFO) Package Directly Assembled on PCB for Mobile Applications

Chen, Cheng, Wang, Teng, Yu, Daquan, Ma, Shuying, Zhu, Kai, Xiao, Zhiyi, Wan, Lixi

Année:

2018

Langue:

english

Fichier:

PDF, 546 KB

english, 2018

45

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Embedded Silicon Fan-Out (eSiFO): A Promising Wafer Level Packaging Technology for Multi-chip and 3D System Integration

Ma, Shuying, Wang, Jiao, Zheng, Fengxia, Xiao, Zhiyi, Wang, Teng, Yu, Daquan

Année:

2018

Langue:

english

Fichier:

PDF, 624 KB

english, 2018

46

Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Adhesive Film Hybrid Bonding and Via-Last TSVs

Yao, Mingjun, Zhao, Ning, Wang, Teng, Yu, Daquan, Xiao, Zhiyi, Ma, Haitao

Journal:

Journal of Electronic Materials

Année:

2018

Langue:

english

Fichier:

PDF, 7.20 MB

english, 2018

47

Extracts of Coleus forskohlii relieves cough and asthma symptoms via modulating inflammation and the extracellular matrix

Ma, Chaozhi, Zou, Liyuan, Xia, Yu, Tu, Yijun, Xue, Daquan, Yang, Yanfang, Liu, Dan, Liu, Yanwen, Wu, Hezhen, Dan, Hanxiong, You, Pengtao

Journal:

Journal of Cellular Biochemistry

Année:

2018

Langue:

english

Fichier:

PDF, 807 KB

english, 2018

48

Potential of recycled concrete aggregate pretreated with waste cooking oil residue for hot mix asphalt

Ma, Jianmin, Sun, Daquan, Pang, Qi, Sun, Guoqiang, Hu, Mingjun, Lu, Tong

Journal:

Journal of Cleaner Production

Année:

2019

Fichier:

PDF, 3.13 MB

2019

49

Low temperature self-healing character of asphalt mixtures under different fatigue damage degrees

Sun, Guoqiang, Sun, Daquan, Guarin, Alvaro, Ma, Jianmin, Chen, Feng, Ghafooriroozbahany, Ehsan

Journal:

Construction and Building Materials

Année:

2019

Langue:

english

Fichier:

PDF, 4.05 MB

english, 2019

50

[IEEE 2019 China Semiconductor Technology International Conference (CSTIC) - Shanghai, China (2019.3.18-2019.3.19)] 2019 China Semiconductor Technology International Conference (CSTIC) - Permanent Bonding Process Development Using Gapless Glue for CIS-TSV Wafer Level Packaging

Wang, Chengqian, Liu, Yi, Zhang, Meng, Ma, Shuying, Xiao, Zhiyi, Yu, Daquan

Année:

2019

Langue:

english

Fichier:

PDF, 1.19 MB

english, 2019